LEITE, T. F. P.; http://lattes.cnpq.br/4836851329007004; LEITE, Thiago Ferreira de Paiva. (BrasilCentro de Engenharia Elétrica e Informática - CEEIUFCGUniversidade Federal de Campina Grande, 2015-08)
The downscale of semiconductors’ feature size has led to increases in vulnerability of
digital circuitry to process, voltage and temperature variations. To reduce these impacts,
manufacturing technologies such as FD-SOI ...