Fotônica integrada para redes ópticas flexíveis usando supercanais ópticos.

Abstract

Photonics involves the technology of signal processing, transmission and detection where the signal is carried by photons. A high level of integration is desirable to low the costs in photonic chips fabrication. However, only a few hundreds of different components are integrated in a single chip due to the complexity of photonic circuits and to the needs of hybrid integration to improve the performance of the devices. In this work, the main components, that constitute these chips, were studied, given its advantages and disadvantages, focusing in common materials, such as silicon and graphene, looking for solutions that require less complex manufacturing processes. To the electronics bottlenecks, in the devices based on electro-optical technology, a solution is introduced to reach OFDM signals with rates of terabits per second based in an integrated circuit architecture of three layers.